Description
- Middle-temperature solder paste with a 183℃ melting point for precision reflow and microsoldering
- Ideal for IC reballing, pad repair, component installation and multilayer board work
- Provides smooth application and strong, reliable solder joints
- Low-residue formula suitable for mobile device logic boards and fine-pitch components
- 50g container offers ample material for professional repair benches
- YCS formulation optimized for consistency and stability in board-level repair environments