Description
- Low-temperature solder paste with a 150℃ melting point for controlled reflow and repair work
- Ideal for heat-sensitive ICs, flex cables and multilayer mobile logic boards
- Reduces risk of overheating delicate components during microsoldering and IC installation
- Provides smooth application and reliable solder joints for fine-pitch components
- 50g container suitable for daily professional repair bench use
- YCS solder paste engineered for consistency, stability and clean low-heat performance