Description
- Low-temperature solder paste with a 138℃ melting point for heat-sensitive reflow work
- Ideal for repairing delicate components, flex cables and multilayer logic boards
- Reduces risk of thermal damage during IC installation, pad repair and microsoldering
- Applies smoothly for precise placement on fine-pitch and small electronic components
- 50g container suitable for professional repair benches and frequent use
- YCS formulation engineered for stability, consistency and clean solder joints at low heat