Description
- High-temperature solder paste with a 215℃ melting point for advanced reflow and rework applications
- Ideal for multilayer logic board repair, IC installation, pad rebuilding and high-heat operations
- Provides strong, durable solder joints capable of withstanding elevated operating temperatures
- Smooth application for precise placement on fine-pitch and micro-components
- 50g container suitable for professional repair labs and high-volume workflows
- YCS solder paste formulated for stability, consistency and reliable performance under heat