Description
- High-temperature solder paste with a 199℃ melting point for demanding reflow and rework applications
- Ideal for multilayer logic board repair, IC installation, pad restoration and high-heat microsoldering
- Produces strong, reliable solder joints capable of withstanding elevated operating temperatures
- Smooth, consistent application suitable for fine-pitch and micro-component work
- 50g container provides ample material for routine use in professional repair labs
- YCS solder paste formulated for stability and dependable performance under high heat