Description
- Tin mesh designed for precise reballing of iPhone 11 Pro, 11 Pro Max and XS Max logic board solder pads
- Restores damaged or missing pad structures during IC replacement and multilayer board repair
- Ensures accurate alignment and consistent solder distribution across rebuilt sections
- Ideal for CPU, PMIC and mid-layer module reballing on the listed iPhone models
- High-temperature resistant mesh suitable for professional microsoldering workflows
- YCS mesh engineered for accuracy, durability and stable performance in board-level rework
