Description
- Mid-layer solder mesh designed for precise reballing of iPhone 16 Pro and 16 Pro Max multilayer logic boards
- Restores damaged or missing solder points across internal board layers
- Ensures accurate alignment during reconstruction of middle-layer solder pads
- Ideal for repairing CPU, PMIC and complex IC modules in the iPhone 16 Pro series
- High-temperature resistant mesh optimized for professional microsoldering environments
- YCS mesh engineered for consistent accuracy in advanced board-level rework













