Description
- Tin mesh designed for accurate reballing of iPhone 14 Pro and 14 Pro Max logic board solder pads
- Ensures precise restoration of pad structures during middle-layer and IC rework
- Improves alignment and consistency for CPU, PMIC and multilayer module repairs
- High-temperature resistant mesh suitable for professional microsoldering work
- Optimized for restoring missing or damaged solder points across internal board layers
- YCS mesh engineered for stable, reliable performance in advanced board-level repair













