Description
- Tin mesh designed for precise reballing of iPhone 13 Pro Max logic board solder pads
- Restores damaged or missing pad structures during multilayer and IC-level repair
- Ensures accurate alignment and uniform solder distribution across reworked sections
- Ideal for CPU, PMIC and mid-layer component reballing on the iPhone 13 Pro Max
- High-temperature resistant mesh suitable for professional microsoldering tasks
- YCS mesh engineered for consistency, accuracy and durability in board-level rework













