Description
- Tin mesh designed for precise reballing of iPhone 12 Pro Max logic board solder pads
- Restores damaged or missing pad structures during IC and multilayer board repair
- Ensures accurate alignment and consistent solder distribution across reworked areas
- Ideal for CPU, PMIC and mid-layer module reballing on the iPhone 12 Pro Max
- High-temperature resistant mesh suitable for professional microsoldering workflows
- YCS mesh engineered for reliability and accuracy in board-level rework













