Description
- Mid-layer solder mesh designed for accurate reballing of the iPhone 17 Air Power module and Front Camera NFC module
- Restores damaged or missing mid-layer solder points during advanced logic board repair
- Ensures precise pad alignment for stable electrical connectivity across multilayer structures
- Ideal for high-precision work on power, NFC and camera-related IC modules
- High-temperature resistant mesh compatible with professional microsoldering stations
- Engineered by YCS for consistent performance in advanced board-level workflows
