Description
- Mid-layer solder mesh designed for accurate reballing of iPhone 17, 17 Pro and 17 Pro Max multilayer boards
- Ensures precise restoration of solder points across middle layers during board-level repair
- Improves alignment and consistency when rebuilding damaged or missing solder pads
- Ideal for CPU, PMIC and multilayer IC repair on iPhone 17 series logic boards
- High-temperature resistant mesh compatible with professional microsoldering workflows
- YCS mesh optimized for reliability and accuracy in advanced logic board rework












