Description
- Universal middle frame reballing platform engineered for iPhone 17 series logic board repair
- Provides stable positioning for CPU, PMIC and middle-frame ICs during reballing and high-precision soldering
- Adjustable design supports multiple iPhone 17 series frame layouts for versatile use
- Heat-resistant build ensures durability under rework station temperatures
- Improves alignment accuracy and reduces component movement during repair
- Designed for professional microsoldering workflows and compatible with Qianli rework tools
