Description
- The YCS DB02 Multi-Function Spudger Blade Set is designed for mobile phone CPU, NAND Flash, and IC chip glue removal, providing precision and control during motherboard and board-level repair work.
- Includes a non-slip textured handle that offers a stable grip for safe scraping, lifting, and glue removal around delicate components.
- Equipped with strong, durable blades suitable for removing hard glue, underfill, and residue found around BGA chips.
- Comes in a premium metal storage case that is sturdy, portable, and convenient for technicians who work on the go.
- The 9-in-1 kit includes three 9G handles and six interchangeable blades to support various disassembly and repair needs.
- Lightweight design reduces operator fatigue and improves overall repair efficiency during long work sessions.
- Suitable for multiple repair scenarios, including mobile phones, tablets, electronic circuits, and other digital device repairs.
- Specifications: Model YCS DB02; product size 140 × 8 mm; packaging size 60 × 175 × 20 mm.
- Package includes: 1 × metal case, 3 × 9G handles, 6 × blades.